MARC状态：审校 文献类型：西文图书 浏览次数：4
- 题名/责任者:
- IEEE 3d Internationl geoscience electronics symposium symposiun, Washington, Aug. 25-27,1971 digest of technical papers. Sponsored by IEEE.
- 出版发行项:
- New York IEEE, 1972.
- 载体形态项:
- [76]p. ill. ; 29cm.
- 会议名称:
- Internationl geoscience electronics symposium symposiun. Washington, 1971.
- 中图法分类号:
- P183
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