MARC状态:审校 文献类型:西文图书 浏览次数:5
- 题名/责任者:
- 20th Electronic Components Conference, Washington, D.C., May 13-15, 1970 / sponsored by the Electronic Industries Association (EIA) and the Parts, Materials and Packaging Group (GPMP) of the Institute of Electrical and Electronic Engineers.
- 出版发行项:
- New York : Institute of Electrical and Electronics Engineers, c1970.
- 载体形态项:
- 638 p. : ill. ; 28 cm.
- 会议名称:
- Electronic Components Conference (20th : 1970 : Washington, D.C.)
- 附加团体名称:
- Institute of Electrical and Electronics Engineers. Parts, Materials and packaging Group (GPMP)
- 论题主题:
- Electronic apparatus and appliances-Congresses.
- 论题主题:
- Electronic industries-Congresses.
- 论题主题:
- Microelectronics-Congresses.
- 论题主题:
- Seminconductors-Congresses.
- 中图法分类号:
- TN11-53
- 书目附注:
- Includes bibliographical references.
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