机读格式显示(MARC)

• 000 00997nam a2200241 a 4500

• 001 0000333967

• 003 CAL

• 005 20200824151300.0

• 008 081201s1986 njua c 000 0 eng d

• 040 __ |a SDU |c SDU

• 090 __ |a TN305-63/P976

• 093 __ |a TN305-63 |2 4

• 099 __ |a CALB0220110189388m

• 245 10 |a Published search : |b Microlithography and microetching in semiconductor device manufacturing and processing (Jan 75 - Oct 86) : (citations from the INSPEC database).

• 246 3_ |a Microlithography and microetching in semiconductor device manufacturing and processing (Jan 75 - Oct 86) : |b (citations from the INSPEC database)

• 246 3_ |a Citations from the INSPEC: Information Service for the Physics and Engineering Communities

• 260 __ |a [Linden, N.J. : |b NTIS, |c 1986?]

• 300 __ |a 82, 43 p. : |b ill. ; |c 27 cm.

• 500 __ |a Cover title.

• 500 __ |a "PB86-876836."

• 710 0_ |a U.S. Department of Commerce. |b National Technical Information Service.

• 920 __ |a 237010 |z 2

• 998 __ |a SDU