机读格式显示(MARC)

• 000 01289nam a2200289 a 4500

• 001 0000341585

• 003 CAL

• 005 20200825164700.0

• 008 980605s1970 nyua b 100 0 eng d

• 040 __ |a BUPTL |c BUPT

• 050 00 |a TK7870 |b .E215 1970

• 090 __ |a TN11-53/E38-3

• 093 __ |a TN11-53

• 099 __ |a CAL 021999651422

• 111 2_ |a Electronic Components Conference |n (20th : |d 1970 : |c Washington, D.C.)

• 245 10 |a 20th Electronic Components Conference, Washington, D.C., May 13-15, 1970 / |c sponsored by the Electronic Industries Association (EIA) and the Parts, Materials and Packaging Group (GPMP) of the Institute of Electrical and Electronic Engineers.

• 246 04 |a Proceedings 1970 20th Electronic Components Conference.

• 260 __ |a New York : |b Institute of Electrical and Electronics Engineers, |c c1970.

• 300 __ |a 638 p. : |b ill. ; |c 28 cm.

• 504 __ |a Includes bibliographical references.

• 650 _0 |a Electronic apparatus and appliances |x Congresses.

• 650 _0 |a Electronic industries |x Congresses.

• 650 _0 |a Microelectronics |x Congresses.

• 650 _0 |a Seminconductors |x Congresses.

• 710 2_ |a Institute of Electrical and Electronics Engineers. |b Parts, Materials and packaging Group (GPMP)

• 710 2_ |a Electronic Industries Association (EIA)

• 998 __ |a BUPT